Body-mountable device with a common substrate for electronics and battery

ABSTRACT

An example device includes a silicon substrate having a first substrate surface and a second substrate surface; a plurality of layers associated with one or more electronic components of an integrated circuit (IC), where the plurality of layers are deposited on the second substrate surface; a lithium-based battery having a plurality of battery layers deposited on the first substrate surface of the silicon substrate, where the lithium-based battery includes an anode current collector and a cathode current collector; a first through-silicon via (TSV) passing through the silicon substrate and providing an electrical connection between the anode current collector and the plurality of layers associated with the one or more electronic components of the IC; and a second TSV passing through the silicon substrate and providing an electrical connection between the cathode current collector and the plurality of layers associated with the one or more electronic components of the IC.

CROSS REFERENCE TO RELATED APPLICATION

The present application is a continuation of U.S. patent applicationSer. No. 14/863,510, filed on Sep. 24, 2015, and entitled“Body-Mountable Device with a Common Substrate for Electronics andBattery,” the entire contents of which are herein incorporated byreference as if fully set forth in this description.

BACKGROUND

Microelectronic components are widely used in the production of avariety of electronic devices (e.g., wearable computing device, portablecomputers, mobile device, etc.). Development of such microelectronicdevices has brought about the evolution of batteries as miniature powersupplies. Such batteries can be, for example, lithium-based batteries.

SUMMARY

The present disclosure describes embodiments that relate to methods,devices, and systems associated with a common substrate for electronicsand a battery. In one aspect, the present disclosure describes a device.The device includes a silicon substrate having a first substrate surfaceand a second substrate surface opposite the first substrate surface. Thedevice also includes a plurality of layers associated with one or moreelectronic components of an integrated circuit, where the plurality oflayers are deposited on the second substrate surface. The device furtherincludes a lithium-based battery having a plurality of battery layersdeposited on the first substrate surface of the silicon substrate. Thelithium-based battery includes an anode current collector and a cathodecurrent collector defined within the plurality of battery layers andcontacting the first substrate surface. The device also includes a firstthrough-silicon via (TSV) passing through the silicon substrate andproviding an electrical connection between the anode current collectorand the plurality of layers associated with the one or more electroniccomponents of the integrated circuit. The first TSV includes a firstconductive channel insulated from the silicon substrate by a firstinsulating layer surrounding the first conductive channel. The devicefurther includes a second TSV passing through the silicon substrate andproviding an electrical connection between the cathode current collectorand the plurality of layers associated with the one or more electroniccomponents of the integrated circuit. The second TSV includes a secondconductive channel insulated from the silicon substrate by a secondinsulating layer surrounding the second conductive channel.

In another aspect, the present disclosure describes a method. The methodincludes providing a silicon substrate having a first substrate surfaceand a second substrate surface opposite the first substrate surface. Themethod also includes depositing a plurality of layers associated withone or more electronic components of an integrated circuit on the secondsubstrate surface. The method further includes depositing a plurality ofbattery layers of a lithium-based battery on the first substrate surfaceof the silicon substrate. The lithium-based battery includes an anodecurrent collector and a cathode current collector defined within theplurality of battery layers and contacting the first substrate surface.The method also includes forming a first TSV in the silicon substrate toprovide an electrical connection between the anode current collector andthe plurality of layers associated with the one or more electroniccomponents of the integrated circuit. The first TSV comprises a firstconductive channel insulated from the silicon substrate by a firstinsulating layer surrounding the first conductive channel. The methodfurther includes forming a second TSV in the silicon substrate toprovide an electrical connection between the cathode current collectorand the plurality of layers associated with the one or more electroniccomponents of the integrated circuit. The second TSV comprises a secondconductive channel insulated from the silicon substrate by a secondinsulating layer surrounding the second conductive channel.

In still another aspect, the present disclosure describes a system. Thesystem includes a silicon substrate having a first substrate surface anda second substrate surface opposite the first substrate surface. Thesystem also includes one or more electronic components coupled to thesecond substrate surface. The system further includes a lithium-basedbattery having a plurality of battery layers deposited on the firstsubstrate surface of the silicon substrate such that the siliconsubstrate is configured as a common substrate for the one or moreelectronic components and the lithium-based battery. The lithium-basedbattery includes an anode current collector and a cathode currentcollector defined within the plurality of battery layers and contactingthe first substrate surface. The system also includes a first TSVpassing through the silicon substrate and providing an electricalconnection between the anode current collector and the plurality oflayers associated with the one or more electronic components, and asecond TSV passing through the silicon substrate and providing anelectrical connection between the cathode current collector and theplurality of layers associated with the one or more electroniccomponents. The system further includes an additional substrate havingone or more conductive traces in electrical communication with the oneor more electronic components via a conductive adhesive.

The foregoing summary is illustrative only and is not intended to be inany way limiting. In addition to the illustrative aspects, embodiments,and features described above, further aspects, embodiments, and featureswill become apparent by reference to the figures and the followingdetailed description.

BRIEF DESCRIPTION OF THE FIGURES

FIG. 1 illustrates a lithium-based battery, in accordance with anexample implementation.

FIG. 2 illustrates a lithium-based battery sharing a common substratewith layers of an integrated circuit, in accordance with an exampleimplementation.

FIG. 3 illustrates expansion of a lithium-based battery during charging,in accordance with an example implementation.

FIG. 4 illustrates electrical coupling of layers of an integratedcircuit to an additional substrate, in accordance with an exampleimplementation.

FIG. 5 illustrates an eye-mountable device, in accordance with anexample implementation.

FIG. 6 illustrates a body-mountable device, in accordance with anexample implementation.

FIG. 7 is a flow chart of a method for making a device with a commonsubstrate for battery and electronics, in accordance with an exampleimplementation.

DETAILED DESCRIPTION

The following detailed description describes various features andfunctions of the disclosed systems and methods with reference to theaccompanying figures. The illustrative system and method embodimentsdescribed herein are not meant to be limiting. It may be readilyunderstood that certain aspects of the disclosed systems and methods canbe arranged and combined in a wide variety of different configurations,all of which are contemplated herein.

Further, unless context suggests otherwise, the features illustrated ineach of the figures may be used in combination with one another. Thus,the figures should be generally viewed as component aspects of one ormore overall implementations, with the understanding that not allillustrated features are necessary for each implementation.

Additionally, any enumeration of elements, blocks, or steps in thisspecification or the claims is for purposes of clarity. Thus, suchenumeration should not be interpreted to require or imply that theseelements, blocks, or steps adhere to a particular arrangement or arecarried out in a particular order.

I. OVERVIEW

Body-mountable electronic devices are increasing in complexity and mayinclude a plurality of electronic components, sensors, transceivers, andone or more batteries. Disclosed herein are methods, devices, andsystems relating to electrically and mechanically connecting the batterywith an active area of a silicon substrate while facing away from thesubstrate. These methods, devices, and systems further involve thebattery and other electronic components sharing a common substrate so asto reduce complexity of device fabrication and mitigate effects ofbattery expansion during charging.

Particularly, a battery may be fabricated on, or bonded to, a back sideof an integrated circuit (IC). The battery may thus share the substrateof the IC instead of having its own substrate. As an example forillustration, a complementary metal-oxide semiconductor (CMOS) chip maybe fabricated on a silicon substrate, which is also a substrate thatcould be used for making solid state lithium batteries. In this example,the CMOS chip and the battery could share the same substrate. The anodeand cathode current collectors of the battery may then be connected toelectronic components of the chip by way of through-silicon vias (TSVs)disposed within the substrate. Generally, a TSV is a vertical electricalconnection (via) passing through a silicon wafer or die. A TSV providesan interconnect technique used as an alternative to wire-bond andflip-chip techniques.

Thus, the battery may share a common substrate with other components ofan IC, and may provide power to the components using the TSVs. Thisconstruction is more efficient and may reduce complexity of devicefabrication and the number of assembly steps for making the device, thusreducing cost and improving manufacturing yield.

II. EXAMPLE DEVICES

FIG. 1 illustrates a lithium-based battery 100, in accordance with anexample implementation. More particularly, FIG. 1 shows example batterylayers of the lithium-based battery 100. As shown in FIG. 1, thelithium-based battery 100 may include the following layers: (1) asubstrate 102 (e.g., a silicon substrate); (2) a cathode currentcollector 104; (3) an anode current collector 106; (4) a cathode 108;(5) an electrolyte 110; (6) an anode 112; and (7) a package (orprotective coating) 114. These materials and layers are examples forillustration only. Other configurations of battery layers could be usedin a lithium-based battery.

As mentioned above, to reduce complexity of a device, the lithium-basedbattery 100 could share the substrate 102 with other electroniccomponents. For example, the substrate 102 could also be a substrate ofan IC, where the battery layers are deposited on a surface 116 of thesubstrate 102, and layers of the electronic components of the IC aredeposited on an opposite surface 118. Such construction is shown in FIG.2.

FIG. 2 illustrates the lithium-based battery 100 sharing the substrate102 with layers 200 of an IC, in accordance with an exampleimplementation. As shown in FIG. 2, the layers 200 of the IC aredeposited on the surface 118 of the substrate 102. As examples, thelayers 200 may be associated with electronic components such as sensors,antennae, memory chips, etc.

As shown in both FIGS. 1 and 2, the cathode current collector 104 andthe anode current collector 106 are both defined within the layers ofthe lithium-based battery 100 and are configured to contact the surface116 of the substrate 102. A first TSV 202 passes through the substrate102 and is configured to electrically connect the cathode currentcollector 104 to the layers 200 of the IC.

The TSV 202 includes a conductive channel 204 made of a conductivematerial (e.g., gold, nickel, etc.). The conductive channel 204 isinsulated from the substrate 102 by an insulating layer 206 (e.g., adielectric material) surrounding the conductive channel 204.

Similarly, a second TSV 208 passes through the substrate 102 and isconfigured to electrically connect the anode current collector 106 tothe layers 200 of the IC. The TSV 208 includes a conductive channel 210made of a conductive material. The conductive material of the conductivechannel 210 may be similar to the conductive material of the conductivechannel 204, for example. The conductive channel 210 is insulated fromthe substrate 102 by an insulating layer 212 surrounding the conductivechannel 210. Thus, the lithium-based battery 100 and the layers 200 ofthe IC share the same substrate 102, and the lithium-based battery 100provides electric power to the electronic components of the IC using theTSVs 202 and 208. This construction eliminates redundancy of having onesubstrate for the lithium-based battery 100, and another substrate forthe IC, thus reducing complexity and cost of fabricating electronicdevices.

Further, the configuration shown in FIG. 2 may mitigate effects ofbattery expansion during charging. A solid-state lithium-ion battery,such as the lithium-based battery 100, may be manufactured such thatlittle or no elemental lithium is present in the battery when thebattery is uncharged. This can be useful in situations where the batterywill be integrated into another device that undergoes furtherprocessing. In particular, the presence of lithium may be undesirable infurther processing steps that include exposure to oxygen, moisture,and/or heat conditions.

During charging, however, lithium is produced and may be plated betweenthe anode and the electrolyte of the battery. Also, charging thelithium-based battery may produce pressure and heat inside thelithium-based battery. Production of lithium and/or generation ofpressure and heat, or other factors, may cause the battery to swell orexpand during charging. The expansion can cause considerable stress andstrain in a structure of the lithium-based battery.

FIG. 3 illustrate expansion of the lithium-based battery 100 duringcharging, in accordance with an example implementation. As shown in FIG.3, the layers of the lithium-based battery 100 are deposited on thesurface 116 such that the outward bulging resulting from expansion ofthe lithium-based battery 100 is directed away from the substrate 102.Thus, expansion of the lithium-based battery 100 during charging mightnot affect or interfere with operation of the lithium-based battery 100or the IC, and the structure of the lithium-based battery 100 might notbe stressed.

III. EXAMPLE SYSTEMS

In examples, the device illustrated in FIGS. 1-3 can be integrated intoother systems. For instance, the IC and the lithium-based battery 100could be coupled to other devices having other electronic components.These other devices may have their own substrates, and the layers 200 ofthe IC may be electrically coupled to a substrate of another device.This way, the lithium-based battery 100 and the electronic components ofthe IC may be electrically coupled with electronic components of theother device.

FIG. 4 illustrates coupling the layers 200 of the IC to an additionalsubstrate 400, in accordance with an example implementation. Theadditional substrate 400 may be associated with other structures ordevices having electronic components such as application specific ICs(ASICs), sensors, other batteries, antennae, chips, etc. The additionalsubstrate 400 may be made of a polymeric material (e.g., parylene), forexample.

The additional substrate 400 may have one or more conductive traces suchas conductive traces 402 and 404. The conductive traces 402 and 404 maybe configured to carry electric signals to and from electroniccomponents (not shown) associated with the additional substrate 400. Toachieve electric contact with the layers 200 of the IC, the conductivetraces 402 and 404 may be coupled via an electrically-conductiveadhesive 406 to the layers 200.

The adhesive 406 can take several forms. For instance, the adhesive 406may take the form of a film applied to the conductive traces 402 and404. In another example, the adhesive 406 may be applied as drops to theconductive traces 402 and 404 and/or corresponding traces (not shown)coupled to the layers 200. In examples, the adhesive 406 may be flexibleto allow relative motion between the layers 200 and the additionalsubstrate 400. However, in other examples, the adhesive 406 may berigid.

In an example, the adhesive 406 may include an anisotropic conductivepaste (ACP). The ACP may include an epoxy-based adhesive containingmetallic particles. However, in other examples, the adhesive 406 mayinclude isotropically conductive adhesive material such as a polymericmaterial containing metallic particles (e.g., silver flakes). Otheradhesives could be used as well.

In a specific example, the additional substrate 400 may be embeddableinto a body-mountable device, such as an eye-mountable device (i.e.,contact lens) or any other body-mountable sensing platform. In thiscase, the additional substrate 400 may represent a bio-compatiblesubstrate that could be embedded within a body-mountable device.

FIG. 5 illustrates an eye-mountable device 500, in accordance with anexample implementation. As shown in FIG. 5, the additional substrate 400to which the layers 200, the substrate 102, and the lithium-basedbattery 100 are coupled, is embedded within the eye-mountable device500. Although the additional substrate 400 is depicted as mounted in acentral portion of the eye-mountable device 500, the additionalsubstrate 400 can be mounted in other portions. Also, the depiction inFIG. 5 is not meant to be to scale. The additional substrate 400 andother components attached thereto may have a size that is smaller thanthe size shown in FIG. 5 relative to the eye-mountable device 500. Forinstance, the size may be sufficiently small and the additionalsubstrate 400 may be embedded toward a peripheral part of theeye-mountable device 500 so as to not block a line of sight of a wearerof the eye-mountable device 500.

In examples, the eye-mountable device 500 may be made of a polymericmaterial. The additional substrate 400, the layers 200, the substrate102, and the lithium-based battery 100 may be made of bio-compatiblematerials appropriate for an environment of contact lens, for example.The additional substrate 400 can be mounted to other portions of a bodyas illustrated in FIG. 6.

FIG. 6 illustrates a body-mountable device 600, in accordance with anexample implementation. The body-mountable device 600 may, for example,be mounted on an arm 602, or other portions of a body of a wearer. Theadditional substrate 400 may be made as a flexible substrate, as shownin FIG. 6, and may be mountable to a skin surface of the arm 602.Sensors and associated sensor probes may be mounted to or disposed on orwithin the additional substrate 400 to detect one or more physiologicalproperties of skin. Example physiological properties include aconcentration of an analyte in interstitial fluid within the skin.Sensor measurements can be then be communicated for further processingthrough the conductive traces 402 and 404 to the layers 200 associatedwith the IC sharing the substrate 200 with the lithium-based battery 100(not shown in FIG. 6).

IV. EXAMPLE METHODS

FIG. 7 is a flow chart of a method 700 for making a device with a commonsubstrate for battery and electronics, in accordance with an exampleimplementation. The method 700 may include one or more operations oractions as illustrated by one or more of blocks 702-710. Although theblocks are illustrated in a sequential order, these blocks may in someinstances be performed in parallel, and/or in a different order thanthose described herein. Also, the various blocks may be combined intofewer blocks, divided into additional blocks, and/or removed based uponthe desired implementation.

At block 702, the method 700 includes providing a silicon substratehaving a first substrate surface and a second substrate surface oppositethe first substrate surface. The term “providing” as used herein withregard to a silicon substrate includes any action to make the siliconsubstrate available for use, such as bringing the silicon substrate toan apparatus or to a work environment for further processing of thesilicon substrate (e.g., for depositing layers on the silicon substrate,coupling the silicon substrate to another component, etc.).

In line with the discussion related to FIGS. 1-6, a silicon substrate,such as the substrate 102, may be configured to have a first surface anda second surface opposite the first surface. The silicon substrate maybe configured as a common substrate for a battery and other electroniccomponents of an IC. In examples, the silicon substrate may includeglass-ceramics to enable the silicon substrate to withstand heat duringfurther processing or operations of the method 700.

At block 704, the method 700 includes depositing a plurality of layersassociated with one or more electronic components of an IC on the secondsubstrate surface. Layers, such as the layers 200, associated withelectronic components of an IC may be deposited on the second surface ofthe silicon substrate. The electronic components may include sensors,transceivers, antennae, etc. The layers of the electronic components canbe deposited using microfabrication and/or manufacturing techniques suchas, for example, electroplating, photolithography, deposition, and/orevaporation fabrication processes and the like. The layers may be formedaccording to patterns using photoresists and/or masks to patternmaterials in particular arrangements, such as to form wires, electrodes,electrical contacts, etc.

At block 706 of the method 700, the method includes depositing aplurality of battery layers of a lithium-based battery on the firstsubstrate surface of the silicon substrate. A lithium-based battery,such as the battery 100, may include a plurality of layers. Examplelayers include a cathode current collector, an anode current collector,a cathode, an electrolyte, an anode, and a protective package orcoating. As described with respect to FIG. 2, the anode currentcollector and the cathode current collector may be defined within theplurality of battery layers of the lithium-based battery and may beconfigured to contact the first substrate surface of the siliconsubstrate (opposite to the layers of the electronic components).

The lithium-based battery may be of a type that, during charging,experiences swelling or expansion. For instance, during charging,lithium is produced and is plated between the anode and the electrolyteof the lithium-based battery. Production of lithium, or other factors,causes the lithium-based battery to swell or expand. The expansion cancause considerable stress and strain in a structure of the lithium-basedbattery. The layers of the lithium-based battery are deposited on thefirst surface of the silicon substrate such that the outward bulgingresulting from expansion of the lithium-based battery is directed awayfrom the silicone substrate. In this manner, the expansion of thelithium-based battery during charging might not affect operation of, orstress, the lithium-based battery or the IC.

At block 708 of the method 700 includes forming a first TSV in thesilicon substrate to provide an electrical connection between the anodecurrent collector and the plurality of layers associated with the one ormore electronic components of the IC, where the first TSV comprises afirst conductive channel insulated from the silicon substrate by a firstinsulating layer surrounding the first conductive channel. As mentionedabove, a TSV is a vertical electrical connection passing through asilicon wafer or die.

Forming the first TSV may include machining a channel or a hollow pipewith near-vertical sidewalls through a thickness of the siliconsubstrate. A dielectric film may be applied to the sidewalls of thechannel to form the first insulating layer. The dielectric film may beoverlaid with conductive metal and/or the conductive metal may fill thechannel. The conductive metal may thus form the first conductive channelthat establishes an electric pathway between the anode current collectorand the plurality of layers of the one or more electronic components ofthe IC. Other manufacturing techniques could be used to form the firstTSV.

At block 710 of the method 700 includes forming a second TSV in thesilicon substrate to provide an electrical connection between thecathode current collector and the plurality of layers associated withthe one or more electronic components of the IC, where the second TSVcomprises a second conductive channel insulated from the siliconsubstrate by a second insulating layer surrounding the second conductivechannel.

The techniques described at block 708 for forming the first TSV can alsobe used to form a second TSV to establish an electric pathway betweenthe cathode current collector of the lithium-based battery and thelayers associated with the electronic components of the integratecircuit.

In examples, the method 700 may further include coupling the pluralityof layers associated with the one or more electronic components of theIC to an additional substrate of a body-mountable device. As describedwith respect to FIGS. 5 and 6, the coupling may include electricallyconnecting conductive traces disposed on the additional substrate to theelectronic components of the IC. For instance, an ACP may be applied tothe conductive traces disposed on the additional substrate and/orapplied to corresponding conductive traces of the electronic componentsof the IC. When the additional substrate is coupled to the electroniccomponents, the ACP provides a conductive pathway therebetween. Inexamples, the ACP could be an epoxy-based adhesive containing metallicparticles. However, other isotropic or anisotropic adhesives could beused as well.

Also, as shown in FIG. 5, the body-mountable device could be aneye-mountable contact lens. In other implementations, the body-mountabledevice may take other forms such as skin-mounted patches, as shown inFIG. 6, for example.

V. CONCLUSION

It should be understood that arrangements described herein are forpurposes of example only. As such, those skilled in the art willappreciate that other arrangements and other elements (e.g., machines,interfaces, orders, and groupings of operations, etc.) can be usedinstead, and some elements may be omitted altogether according to thedesired results.

While various aspects and implementations have been disclosed herein,other aspects and implementations will be apparent to those skilled inthe art. The various aspects and implementations disclosed herein arefor purposes of illustration and are not intended to be limiting, withthe true scope being indicated by the following claims, along with thefull scope of equivalents to which such claims are entitled. It is alsoto be understood that the terminology used herein is for the purpose ofdescribing particular implementations only, and is not intended to belimiting.

What is claimed is:
 1. A device comprising: a silicon substrate having afirst substrate surface and a second substrate surface opposite thefirst substrate surface; a plurality of layers associated with one ormore electronic components of an integrated circuit, wherein theplurality of layers are deposited on the second substrate surface; alithium-based battery having a plurality of battery layers deposited onthe first substrate surface of the silicon substrate, wherein thelithium-based battery includes an anode layer, a cathode layer, an anodecurrent collector, and a cathode current collector, wherein the cathodelayer directly contacts the first substrate surface, and wherein theplurality of battery layers includes an electrolyte layer in directcontact with one or more of the first substrate surface, the cathodecurrent collector, and the anode current collector; a firstthrough-silicon via (TSV) passing through the silicon substrate andproviding an electrical connection between the anode current collectorand the plurality of layers associated with the one or more electroniccomponents of the integrated circuit; and a second TSV passing throughthe silicon substrate and providing an electrical connection between thecathode current collector and the plurality of layers associated withthe one or more electronic components of the integrated circuit.
 2. Thedevice of claim 1, wherein the lithium-based battery is a type thatundergoes an expansion during charging in which the expansion of thelithium-based battery causes an outward bulging, and wherein theplurality of battery layers are deposited on the first substrate surfacesuch that the outward bulging is directed away from the siliconsubstrate.
 3. The device of claim 2, wherein the expansion duringcharging is caused at least in part by accumulation of lithium betweenthe anode layer and the electrolyte layer during charging.
 4. The deviceof claim 1, further comprising: an additional substrate having one ormore conductive traces coupled via a conductive adhesive to theplurality of layers associated with the one or more electroniccomponents of the integrated circuit.
 5. The device of claim 4, whereinthe conductive adhesive includes an anisotropic conductive paste (ACP).6. The device of claim 4, wherein the additional substrate is associatedwith an eye-mountable contact lens.
 7. The device of claim 1, whereinthe electrolyte layer is partially disposed between the anode layer andthe cathode layer such that the cathode layer is in direct contact withone or more of the electrolyte layer and the cathode current collector,whereas the anode layer is in direct contact with one or more of theanode current collector and the electrolyte layer without contacting thefirst substrate surface.
 8. The device of claim 1, wherein theintegrated circuit comprises a complementary metal-oxide semiconductor(CMOS) chip.
 9. A method comprising: providing a silicon substratehaving a first substrate surface and a second substrate surface oppositethe first substrate surface; depositing a plurality of layers associatedwith one or more electronic components of an integrated circuit on thesecond substrate surface; depositing a plurality of battery layers of alithium-based battery on the first substrate surface of the siliconsubstrate, wherein the lithium-based battery includes an anode layer, acathode layer, an anode current collector, and a cathode currentcollector, wherein the cathode layer directly contacts the firstsubstrate surface, and wherein the plurality of battery layers includesan electrolyte layer in direct contact with one or more of the firstsubstrate surface, the cathode current collector, and the anode currentcollector; forming a first through-silicon via (TSV) in the siliconsubstrate to provide an electrical connection between the anode currentcollector and the plurality of layers associated with the one or moreelectronic components of the integrated circuit; and forming a secondTSV in the silicon substrate to provide an electrical connection betweenthe cathode current collector and the plurality of layers associatedwith the one or more electronic components of the integrated circuit.10. The method of claim 9, wherein the lithium-based battery is a typethat undergoes an expansion during charging in which the expansion ofthe lithium-based battery causes an outward bulging, and whereindepositing the plurality of battery layers on the first substratesurface is such that the outward bulging is directed away from thesilicon substrate.
 11. The method of claim 10, wherein the expansionduring charging is caused at least in part by accumulation of lithiumbetween the anode layer and the electrolyte layer during charging. 12.The method of claim 9, further comprising: coupling the plurality oflayers associated with the one or more electronic components of theintegrated circuit to an additional substrate of a body-mountabledevice.
 13. The method of claim 12, wherein the additional substrateincludes one or more conductive traces, and wherein the couplingincludes coupling the one or more conductive traces to the plurality oflayers via an anisotropic conductive paste (ACP).
 14. The method ofclaim 9, wherein the electrolyte layer is partially disposed between theanode layer and the cathode layer such that the cathode layer is indirect contact with one or more of the electrolyte layer and the cathodecurrent collector, whereas the anode layer is in direct contact with oneor more of the anode current collector and the electrolyte layer withoutcontacting the first substrate surface.
 15. The method of claim 14,wherein the anode current collector and the cathode current collectorare in contact with a battery protective packaging layer, and whereinthe battery protective packaging layer is further in contact with thefirst substrate surface, the electrolyte layer, and the anode layerwithout contacting the cathode layer.
 16. A system comprising: a siliconsubstrate having a first substrate surface and a second substratesurface opposite the first substrate surface; one or more electroniccomponents coupled to the second substrate surface; a lithium-basedbattery having a plurality of battery layers deposited on the firstsubstrate surface of the silicon substrate such that the siliconsubstrate is configured as a common substrate for the one or moreelectronic components and the lithium-based battery, wherein thelithium-based battery includes an anode layer, a cathode layer, an anodecurrent collector and a cathode current collector, wherein the cathodelayer directly contacts the first substrate surface, and wherein theplurality of battery layers includes an electrolyte layer in directcontact with one or more of the first substrate surface, the cathodecurrent collector, and the anode current collector; a firstthrough-silicon via (TSV) passing through the silicon substrate andproviding an electrical connection between the anode current collectorand a plurality of layers associated with the one or more electroniccomponents; a second TSV passing through the silicon substrate andproviding an electrical connection between the cathode current collectorand the plurality of layers associated with the one or more electroniccomponents; and an additional substrate having one or more conductivetraces in electrical communication with the one or more electroniccomponents via a conductive adhesive.
 17. The system of claim 16,wherein the conductive adhesive comprises an anisotropic conductivepaste (ACP) containing metallic particles.
 18. The system of claim 16,wherein the first TSV comprises a first conductive channel insulatedfrom the silicon substrate by a first insulating layer surrounding thefirst conductive channel, and wherein the second TSV comprises a secondconductive channel insulated from the silicon substrate by a secondinsulating layer surrounding the second conductive channel.
 19. Thesystem of claim 16, wherein the additional substrate is associated withan eye-mountable contact lens.
 20. The system of claim 16, wherein theone or more electronic components include an integrated circuit.